Cooling copper plates could slash data center energy use by 90%

Copper plates with micro-fin surface structures could reduce data center cooling energy by 90%, targeting the ~145 TWh annually spent on cooling (30% of 485 TWh total 2025 consumption). The mechanism leverages enhanced surface area for heat dissipation at the chip level. If validated at scale, this is relevant to hyperscaler infrastructure teams, though the research appears early-stage with no deployment data cited.